MS03
Back end machine for TSOP integrated circuits The parts to be processed are supplied in Jedec trays. The output of processed parts can be either in Jedec trays or in tape. The performed operations are, in sequence:
- body integrity check
- laser marking ( writing laser )
- mark inspection
- electrical test
- lead co-planarity check by ICOS
- taping
Two tapes are foreseen at output to avoid to waste time at reel change.
- Cadence:more than 3.000 pieces per hour
Size
length: 150 cm
width: 125 cm
height: 185 cm
Technologies
- Laser marking
- Vision inspection
- Body integrity inspection
- Electrical test
- Lead coplanarity test
- Taping
